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ELECTRONIC PACKAGING : DESIGN, MATERIALS, PROCESS, AND RELIABILITY
by LAU, J;WONG, C.P.

List Price: HK$ 655.50

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¡@ISBN 9780070371354
¡@Subject ENGINEERING
¡@Publisher MH
¡@Publication 1998
¡@Edition Hardcover
¡@Version Original
¡@Description
 
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